F3+ solder paste series provides a full range of Pb-free and Pb containing solder alloys to be used with this flux technology. F3+ is a halide-free, no-clean solder paste with a long stencil life and high tack force. Standard available alloys are S62, SN100C, SAC305 and SCANGe. The SCANGe alloys have a melting range of 8°-11°C, which provides extremely good anti-tombstoning behavior. The low levels of Ag (compared to the SAC305 alloy) combined with the micro additions of Ni and Ge result in fine grain structures and stabilizes Inter Metallic Compounds (IMC).

The same flux technology is used for both Pb-free and SnPb alloys, which makes qualifications easier.



Product Specification

IPC J-STD-004 classification REL0


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