Residue-Free, No-Clean Fluxes

Amerway 825 Halide Free No-Clean Soldering Flux VOC Free Flux -- Amerway 825 No-Clean Low Residue Flux is specially formulated low solids flux fee of any halides, rosin or resin.  This flux was designed for soldering high quality electronic printed circuit boards such as, through-hole, mixed technology, and surface mount assemblies while eliminating the need of a post cleaning process.  Amerway 825 No-Clean Flux features enhanced foaming properties as well as increased activity and low odor.

Application:  Amerway 825 No-Clean Flux may be applied by foam, spray or wave application.  The topside board preheat temperature recommended is 180-220 F.  For obtaining the best soldering results use the following guidelines:

1.  Maintain a consistent foam-head by narrowing of the flux chimney or the use of dual flux stones.

2.  Add fresh flux to maintain proper flux level.

3.  Regularly clean the fluxing equipment.  Never leave foam stone in flux when pressure is not applied.

4.  Clean fluxing stone in flux thinner.

5.  When foam fluxing, flux can be maintained by monitoring the specific gravity, however, control by checking acid number determination is recommended.

6.  Add flux thinner when needed.

Benefits:

• Provides excellent surface wetting.
• Eliminates the need for post soldering cleaning.
• Increased activity.
• May be conformal coated without post-cleaning.
• Conforms to Bellcore Specification TR-NWT-000078, Issue 3, December 1991.
• Conforms to the Joint Industry Standard ANSI/J-std-004, Type M/LO.

Physical Properties:

Specific Gravity                             .105
Pounds/ Gallon                              6.75
Color                                     Water white and clear
Halide Content                               None
Acid Value                                     25.0
Fluoride Test                                  Passed
Silver Chromate Paper                   Passed
Solids Content                                2.0
Flash Point                                     58 F  TCC
Copper Mirror Corrosion Test        Passed
Test Surface Insulation Resistance to IPC-SF-818
    7 days @ 85 C / 85 % RH
    Minimum Requirement                  1.0 X 108  Ohms
    Uncleaned                                    4.2 X 1012 Ohms
    Cleaned in DI water @ 150 F        4.5 X 1012 Ohms
Test to Bellcore Specification TR-NWT 000078
    Test Pattern: Standard Bellcore Test pattern, 0.025 in. wide 
     lines, 0.050 in spacing
     Environment: 35 C, 90% Relative Humidity
     Bias Voltage: 45-50 volts DC
     Test Voltage: 100 volts DC

Boards                   Initial Reading           Final Reading
Control                   8.21 X 1012             9.45 X 1012
Pattern-ups             7.54 X 1011             3.41 X 1012
Pattern-down          7.10 X 1012             4.12 X 1012
Electromigration Resistance Test
Test pattern: IPC-B-25 test patterns, 0.0125 in. space and 0.0125 in wide lines.
Environment: 85 C, 85% RH
Bias Voltage: 100 Volts DC
Test Voltage: 100 Volts DC
Conditioning Potential: 0
Initial Reading: 96 hours conditioning
Final Reading: 500 hours

Boards                   Initial Reading             Final Reading
Control                    4.91 X 1011              5.23 X 1011
Pattern-ups              5.60 X 1011              8.21 X 1011
Pattern-down           7.12 X 1011              8.11 X 1011
Visual Examination: No evidence of dendrites or corrosion when viewed at 10 X magnification.

Safety:  Flammable liquids should be stored in a dry, well ventilated area away from open flames, sparks or direct heat.  As with all Amerway products, a Material Safety Data Sheet is available.