Electronic Rosin-Based Fluxes
Amerway 500 No-Clean Rosin Flux -- Amerway 500 No-Clean Flux is formulated with a small amount of rosin and is non-chloride activated. This unique organic activation system produces excellent solder ability on single-sided and multi-layered bare copper circuitry and solder coated printed circuit boards. Post soldering residues of the Amerway 500 is essentially not visible and will not interfere with pin testing when not removed.
Application: Amerway 500 No-Clean flux was formulated to be applied by spray, wave or foam fluxer. Carefully controlling the amount of flux applied will insure excellent soldering and high SIR values. It is necessary to apply only a minimum amount of this flux to adequately cover the bottom side of the printed circuit board, penetrate holes and wet component leads. When wave or foam fluxing, using an air knife at 10 to 20 psi is recommended for removing excess flux and controlling the evenness of the flux coatings. Flux coated surfaces should be preheated to provide optimum wicking and solder joint formation. The degree of preheat is dependent many variables; such as, conveyor speed, type of components and substrates ect. Entering the solder wave with a topside temperature range of 180-210 F is typical. For foam application, the foam equipment should be supplied with compressed air, free of oil an water. Maintain flux fluid levels sufficiently above the aerator stone to produce an adequate foam height. Adjust air pressure to produce optimum height with foam consisting of uniform bubbles. Flux application will require the addition of flux thinner to replace evaporation losses and maintain the balance in the flux composition. A check of the specific gravity is recommended for maintaining the flux composition. For consistent soldering performance, replace flux periodically. After dumping used flux, the reservoir and aerator stone should be thoroughly cleaned with flux thinner. Refill flux reservoir with fresh flux and allow a few minutes for foam to stabilize before resuming solder operations. Conveyor speed will vary due to machine design and complexity of the printed circuit board. Conveyor speeds range from 4 to 8 feet per minute with a typical rate of 5 feet per minute. Since flux residues are not being removed from the printed circuit boards, the solder wave and spacing between boards must be adjusted so that flux residue from the leading PCB does not contact the next PCB to be soldered. Correct wave flow dynamics must be applied.
Physical Properties:
Specific Gravity .793
Pounds/ Gallon 6.61
Solids 4.0
Water Extract Resistivity > 50,000 ohm - cm
Copper Mirror Test Pass
Silver Chromate Paper Test Pass
Percent Chlorides None
Acid Number 20.0
Surface Insulation Resistance Test 1.4 X 1010
(IPC-TM 650, 7 days)
Flash Point (Seta flash) 58 F
Flux Thinner Amerway 500 Thinner(505)
Maintenance: To insure successful wave soldering of printed circuit boards, clean equipment and wave soldering machine are necessary for best results. Maintain proper solder levels and flux levels when wave or foam fluxing, and removal of dross from the solder pot is very important. Keeping the conveyor clean at all times is also very essential with a no-clean type flux. Do not contaminate printed circuit boards with a dirty conveyor system. Conveyor finger cleaners are available for most wave soldering machines and should be utilized.
Flux Removal: If flux removal is desired, it can be accomplished with Amerway Enviro-Clean 25 detergent and saponifier and water.
Safety Precautions: Keep away from heat, sparks, and open flames. Observe standard precautions for handling and use, such as in well ventilated areas, and avoid prolonged and repeated contact with skin.